Deposition of copper micro-circuitry by capillary focusing

The application of fine line micro-circuitry onto ceramic substrates currently requires a multi step process including printing, baking and sintering. A new, one-step, process utilizing particle impact deposition is presented. This process directs a high velocity stream of copper particles within a helium carrier onto a ceramic substrate. Upon impact the particles deform and adhere to the substrate and to previously deposited particles. The use of a capillary tube as the flow nozzle restricts the jet and the resulting deposited copper to micron scale dimensions. The deposited copper is dense, with near zero porosity. Robot control of the jet position can yield precise conduction lines and component connections.